Issued Patents All Time
Showing 26–34 of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7449366 | Wafer level packaging cap and fabrication method thereof | Moon-chul Lee, Woon-bae Kim, Ji-hyuk Lim, Suk Jin Ham, Jun Sik Hwang +1 more | 2008-11-11 |
| 7417525 | High efficiency inductor, method for manufacturing the inductor, and packaging structure using the inductor | Moon-chul Lee, Woon-bae Kim, Jun Sik Hwang, Chang-youl Moon, In-sang Song | 2008-08-26 |
| 7408434 | Inductor embedded in substrate, manufacturing method thereof, micro device package, and manufacturing method of cap for micro device package | Moon-chul Lee, Woon-bae Kim, Jea Shik Shin, Jun Sik Hwang, Eun Sung Lee | 2008-08-05 |
| 7374972 | Micro-package, multi-stack micro-package, and manufacturing method therefor | Woon-bae Kim, In-sang Song, Ji-hyuk Lim, Suk Jin Ham, Byung-gil Jeong | 2008-05-20 |
| 7285865 | Micro-package, multi-stack micro-package, and manufacturing method therefor | Woon-bae Kim, In-sang Song, Ji-hyuk Lim, Suk Jin Ham, Byung-gil Jeong | 2007-10-23 |
| 7282388 | Method of manufacturing wafer level package type FBAR device | — | 2007-10-16 |
| 7241966 | Wafer level package fabrication method using laser illumination | Kook-hyun Sunwoo, Joo-ho Lee | 2007-07-10 |
| 6965281 | FBAR, FBAR based duplexer device and manufacturing method thereof | Kook-hyun Sunwoo | 2005-11-15 |
| 6946320 | FBAR based duplexer device and manufacturing method thereof | Kook-hyun Sunwoo | 2005-09-20 |