Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11929262 | Stack package and methods of manufacturing the same | Jae-in Won, Dong Woo Kang, Do Yeon Kim | 2024-03-12 |
| 11651975 | Stack package and methods of manufacturing the same | Jae-in Won, Dong Woo Kang, Do Yeon Kim | 2023-05-16 |
| 10770311 | Stack package and methods of manufacturing the same | Jae-in Won, Dong Woo Kang, Do Yeon Kim | 2020-09-08 |
| 8013432 | Package substrate, semiconductor package having the package substrate | Yong-Il Kwak, Jun Hyuk Choi, Jeong Sam Lee | 2011-09-06 |