JP

Jiwoo Park

Samsung: 2 patents #37,631 of 75,807Top 50%
Overall (All Time): #1,814,011 of 4,157,543Top 45%
2
Patents All Time

Issued Patents All Time

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
11705405 Packaged semiconductor devices having spacer chips with protective groove patterns therein — 2023-07-18
11450634 Package substrate and semiconductor package with elevated bonding pad, and comprising the same — 2022-09-20