Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9502341 | Printed circuit board and semiconductor package using the same | Ga Young Kim, Woo-Jae Kim, Young-Hoon Ro | 2016-11-22 |
| 9030021 | Printed circuit board having hexagonally aligned bump pads for substrate of semiconductor package, and semiconductor package including the same | — | 2015-05-12 |