Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7074652 | Method for separating sapphire wafer into chips | Bang Won Oh, Kuk Yi | 2006-07-11 |
| 6864154 | Process for lapping wafer and method for processing backside of wafer using the same | Ju Young Park | 2005-03-08 |
| 6572454 | Apparatus and method of conditioning polishing pads of chemical-mechanical polishing system | Ju Young Park | 2003-06-03 |