Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6407446 | Leadframe and semiconductor chip package having cutout portions and increased lead count | Jae Won Lee, Heui-Seog Kim | 2002-06-18 |
| 6031281 | Semiconductor integrated circuit device having dummy bonding wires | Young Yee Song, Si Chan Sung | 2000-02-29 |
| 5923092 | Wiring between semiconductor integrated circuit chip electrode pads and a surrounding lead frame | — | 1999-07-13 |