Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7323407 | Method of fabricating dual damascene interconnections of microelectronic device using diffusion barrier layer against base material | Kyoung-Woo Lee, Jae-yeol Maeng, Jae Hak Kim, Hong-Jae Shin | 2008-01-29 |