Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7542125 | Method for cutting an LCD substrate using coolant having low surface tension and low viscosity properties in which a partial cut, cooling with coolant and then a full cut takes place after coolant is removed | Gi Heon Kim, Dae-Ho Choo, Baek-Kyun Jeon | 2009-06-02 |
| 6770842 | Method and apparatus for cutting a substrate into multiple pieces with a single irradiation of a laser beam | Dae-Ho Choo, Baek-Kyun Jeon | 2004-08-03 |
| 6713720 | Method for cutting a non-metallic substrate | Baek-Kyun Jeon, Dae-Ho Choo, Yong-Joon Kwon | 2004-03-30 |
| 6653210 | Method and apparatus for cutting a non-metallic substrate using a laser beam | Dae-Ho Choo, Baek-Kyun Jeon | 2003-11-25 |
| 6541730 | Method and apparatus for cutting a non-metal substrate by using a laser beam | Dae-Ho Choo, Baek-Kyun Jeon | 2003-04-01 |