Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10426041 | Method of manufacturing printed-circuit board assembly | Jung-Je Bang, Mi Jin Kim, Sae-Bom Lee, Kun-Tak Kim | 2019-09-24 |
| 9771467 | Thermoplastic resin composition and article comprising the same | Ji-Hye Lee, Joong In KIM, Ha Na RA, Su Hak Bae, Sung Hee Ahn +1 more | 2017-09-26 |
| 9321886 | Silane compound, method for preparing the same, and polycarbonate resin composition including the same | Su Hak Bae, Sung Hee Ahn, Ha Na RA, Hyun Ho Lee | 2016-04-26 |
| 9085674 | Silane compound, method for preparing the same and polycarbonate resin composition comprising the same | Yong Tae Kim, Ha Na RA, Joong In KIM, Su Hak Bae, Ji-Hye Lee +1 more | 2015-07-21 |
| 8327534 | Method of fabricating printed circuit board assembly | Min-Young Park, Young Jun Moon, Gyun Heo, Kyung Woon Jang, Sang Il Hong +1 more | 2012-12-11 |
| 7755181 | IC package and method of manufacturing the same | Tae Sang Park, Se Yeong Jang, Young Jun Moon, Jung-Hyeon Kim, Sung-Wook Kang | 2010-07-13 |