Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| RE49747 | Multilayer ceramic electronic component to be embedded in board, manufacturing method thereof, and printed circuit board having multilayer ceramic electronic component embedded therein | Hee Jung Jung | 2023-12-05 |
| 10028373 | Heat radiating member and printed circuit board including same | Eun Sang Na, Ok Nam Kim | 2018-07-17 |
| 9847172 | Embedded device, and printed circuit board having the same | Eun Sang Na, Jin-Sung Kim, Ok Nam Kim, Tae Hyeok Kim, Jin Man Jung | 2017-12-19 |
| 9424989 | Embedded multilayer ceramic electronic component and printed circuit board having the same | Eun Hyuk Chae, Hai Joon LEE, Young-Don Choi, Jin-Sung Kim | 2016-08-23 |
| 9384896 | Multilayer ceramic electronic component to be embedded in board, manufacturing method thereof, and printed circuit board having multilayer ceramic electronic component embedded therein | Hee Jung Jung | 2016-07-05 |
| 9218909 | Multi-layered ceramic electronic component | Kyu-Ha Lee, Eun Joo Choi, Byung Jun JEON, Hyun Hee Gu, Jeong Ryeol Kim +2 more | 2015-12-22 |