Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8105930 | Method of forming dielectric including dysprosium and scandium by atomic layer deposition and integrated circuit device including the dielectric layer | Bongjin Kuh, Sunjung Kim, Youngsun Kim, Seunghwan Lee, Sangwook Lim +1 more | 2012-01-31 |