Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8698304 | Multi-chip package with spacer for blocking interchip heat transfer | Jae-Wook Yoo, Eun-Seok Cho | 2014-04-15 |
HH
Heo-jung Hwang
Overall (All Time): #3,100,665 of 4,157,543Top 75%
1
Patents All Time