Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11637019 | Method for forming a semiconductor device having protrusion structures on a substrate and a planarized capping insulating layer on the protrusion structures | Chang Sun Hwang, Hyun Ku Kang, Byoung-ho Kwon, Chung-Ki Min | 2023-04-25 |
| 11087990 | Semiconductor device with a stacked structure and a capping insulation layer | Chang Sun Hwang, Hyun Ku Kang, Byoung-ho Kwon, Chung-Ki Min | 2021-08-10 |