Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12027471 | Semiconductor package having stiffener structure | — | 2024-07-02 |
| 11776918 | Semiconductor package having stiffening structure | Suchang LEE, Yunseok Choi | 2023-10-03 |
| 11664346 | Semiconductor package including semiconductor chips and dummy pad | — | 2023-05-30 |
| 11557543 | Semiconductor package | — | 2023-01-17 |
| 11315886 | Semiconductor package having stiffening structure | Suchang LEE, Yunseok Choi | 2022-04-26 |