Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11668558 | Thickness estimation method and processing control method | Jongsu Kim, Wansung Park, Sungha Kim, Jaeyoun Wi, Kijoo HONG +4 more | 2023-06-06 |
| 11579096 | Wafer inspection apparatus and method | Sungha Kim, Hyounggon Kim, Kwangsung Lee, Jongsu Kim, Taejoong Kim +1 more | 2023-02-14 |