Issued Patents All Time
Showing 26–47 of 47 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8002443 | LED array module | Su-ho Shin, Kyu-ho Shin, Soon-cheol Kweon, Seung-tae Choi, Ki Hwan Kwon | 2011-08-23 |
| 7928545 | LED package and fabrication method thereof | Ki Hwan Kwon, Kyu-ho Shin, Soon-cheol Kweon, Arthur Darbinian, Seung-tae Choi +1 more | 2011-04-19 |
| 7821027 | LED package structure and manufacturing method, and LED array module | Su-ho Shin, Soon-cheol Kweon, Kyu-ho Shin, Ki Hwan Kwon, Seung-tae Choi | 2010-10-26 |
| 7784177 | Method of manufacturing an image drum | Kae-dong Back, Ki-deok Bae, Kyu-ho Shin, Soon-cheol Kweon, Won Kyoung Choi +1 more | 2010-08-31 |
| 7781788 | Light emitting device package having a transparent cover | Arthur Darbinian, Seung-tae Choi, Ki Hwan Kwon, Kyu-ho Shin | 2010-08-24 |
| 7755151 | Wafer level package for surface acoustic wave device and fabrication method thereof | Ji-hyuk Lim, Jun Sik Hwang, Woon-bae Kim, Suk Jin Ham, Jong-oh Kwon +1 more | 2010-07-13 |
| 7741774 | Backlight module including at least one luminescence element, and method of fabricating the same | Seung-tae Choi, Ki Hwan Kwon, Su-ho Shin, Ji-hyuk Lim, Kyu-ho Shin | 2010-06-22 |
| 7722166 | Inkjet printhead having piezoelectric actuator and method of driving the piezoelectric actuator | Hwa Sun Lee, Kyu-yeol Lee, Tao-kyung Lee, Jae-woo Chung | 2010-05-25 |
| 7699442 | Piezoelectric inkjet printhead | Seung Mo Lim, Tae Kyung LEE, Jae-woo Chung, Hwa Sun Lee | 2010-04-20 |
| 7553047 | Lighting device | Su-ho Shin, Kyu-ho Shin | 2009-06-30 |
| 7514718 | LED package, manufacturing method thereof, and LED array module using the same | Kyu-ho Shin, Su-ho Shin, Soon-cheol Kweon, Jin-seung Choi | 2009-04-07 |
| 7489327 | Toner adsorption image forming apparatus | Soon-cheol Kweon, Kyu-ho Shin, Kae-dong Back, Ki-deok Bae, Won Kyoung Choi +1 more | 2009-02-10 |
| 7452809 | Fabrication method of packaging substrate and packaging method using the packaging substrate | Moon-chul Lee, Woon-bae Kim, Jun Sik Hwang | 2008-11-18 |
| 7449366 | Wafer level packaging cap and fabrication method thereof | Moon-chul Lee, Jong-oh Kwon, Woon-bae Kim, Ji-hyuk Lim, Suk Jin Ham +1 more | 2008-11-11 |
| 7417525 | High efficiency inductor, method for manufacturing the inductor, and packaging structure using the inductor | Moon-chul Lee, Jong-oh Kwon, Woon-bae Kim, Jun Sik Hwang, In-sang Song | 2008-08-26 |
| 7335974 | Multi stack packaging chip and method of manufacturing the same | Jun Sik Hwang, Woon-bae Kim, Moon-chul Lee, Kyu-dong Jung | 2008-02-26 |
| 7263883 | Gyro-sensor comprising a plurality of component units, and fabricating method thereof | Tae-sik Park, Moon-chul Lee | 2007-09-04 |
| 6884650 | Side-bonding method of flip-chip semiconductor device, MEMS device package and package method using the same | Eun Sung Lee, Byeong-cheon Koh, Kukjin Chun | 2005-04-26 |
| 6619779 | Ink-jet printer head | Chan-bong Jeon, Min Soo Kim | 2003-09-16 |
| 6390581 | Ink jet printer head | Chang Woo Lee, Oh-Hyun Beak, Jae-ho Moon | 2002-05-21 |
| 6244690 | Apparatus for jetting ink using a magnet and a plurality of coils installed on a plate to generate a magnetic field | Oh-keun Kwon, Jae-ho Moon | 2001-06-12 |
| 5669752 | Semiconductor wafer pre-aligning apparatus | — | 1997-09-23 |