CP

Chan-Ik Park

Samsung: 46 patents #2,136 of 75,807Top 3%
PF Postech Academy-Industry Foundation: 4 patents #91 of 1,477Top 7%
CT Communications Technology: 1 patents #18 of 31Top 60%
IBM: 1 patents #44,794 of 70,183Top 65%
Overall (All Time): #46,961 of 4,157,543Top 2%
54
Patents All Time

Issued Patents All Time

Showing 51–54 of 54 patents

Patent #TitleCo-InventorsDate
6983537 Method of making a plastic package with an air cavity 2006-01-10
5943558 Method of making an assembly package having an air tight cavity and a product made by the method Jong Tae Kim 1999-08-24
5862158 Efficient method for providing fault tolerance against double device failures in multiple device systems Sandra Johnson Baylor, Peter F. Corbett 1999-01-19
5778520 Method of making an assembly package in an air tight cavity and a product made by the method Jong Tae Kim 1998-07-14