Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11031307 | Semiconductor package, buffer wafer for semiconductor package, and method of manufacturing semiconductor package | Hyun Ki Seo, Joo-Hyung Lee, Jae Gil Lim | 2021-06-08 |
| 10204869 | Integrated circuit package including shielding between adjacent chips | Soo-Jae Park, Young-Hoon Kim, In-Ku Kang, Hee-Yeol KIM | 2019-02-12 |
| 9978693 | Integrated circuit package, method of fabricating the same, and wearable device including integrated circuit package | Soo-Jae Park, Young-Hoon Kim, In-Ku Kang, Hee-Yeol KIM | 2018-05-22 |