Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7528475 | BGA package with stacked semiconductor chips and method of manufacturing the same | Jun-Young Go, Jae Hong Kim | 2009-05-05 |
| 7262080 | BGA package with stacked semiconductor chips and method of manufacturing the same | Jun-Young Go, Jae Hong Kim | 2007-08-28 |