Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9465900 | System and method for designing semiconductor package using computing system, apparatus for fabricating semiconductor package including the system, and semiconductor package designed by the method | Jae-hoon Jeong, Won Cheol LEE, Young-Hoe Cheon, Chan Hwang | 2016-10-11 |
| 8856714 | Method and system for designing 3D semiconductor package | Sung-Hee Yun, Jae-hoon Jeong, Won Cheol LEE, Tae Heon Lee, Young-Hoe Cheon | 2014-10-07 |