Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11380646 | Multi-sided cooling semiconductor package and method of manufacturing the same | — | 2022-07-05 |
| 9520343 | Field-effect transistor structure for preventing from shorting | — | 2016-12-13 |
| 9472493 | High heat-dissipation chip package structure | — | 2016-10-18 |
| 7859123 | Wire bonding structure and manufacturing method thereof | — | 2010-12-28 |
| 7274098 | Chip packaging structure without leadframe | — | 2007-09-25 |
| 7187064 | Electrical-interference-isolated transistor structure | Shih-Yi Chang | 2007-03-06 |
| 7119420 | Chip packaging structure adapted to reduce electromagnetic interference | — | 2006-10-10 |
| 6963141 | Semiconductor package for efficient heat spreading | Jung-Yu Lee | 2005-11-08 |
| 6921967 | Reinforced die pad support structure | Jun-Chun Shih, Kuang-Yang Chen, Kuo-Chang Tan, Hsi-Hsun Ho, June-Wen Liao +1 more | 2005-07-26 |
| 6211563 | Semiconductor package with an improved leadframe | — | 2001-04-03 |
| 6201302 | Semiconductor package having multi-dies | — | 2001-03-13 |
| 6101101 | Universal leadframe for semiconductor devices | Jung-Yu Lee | 2000-08-08 |
| 5998857 | Semiconductor packaging structure with the bar on chip | — | 1999-12-07 |
| 5973407 | Integral heat spreader for semiconductor package | Jung-Yu Lee | 1999-10-26 |