Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879211 | Method of joining a surface-mount component to a substrate with solder that has been temporarily secured | Robert Conte, Ching Au | 2020-12-29 |
| D803795 | Surface mount device | Ching Au, David Peng | 2017-11-28 |
| D803796 | Surface mount device | Ching Au, David Peng | 2017-11-28 |
| D803797 | Surface mount device | Ching Au, David Peng | 2017-11-28 |
| D803798 | Surface mount device | Ching Au, David Peng | 2017-11-28 |
| 9392713 | Low cost high strength surface mount package | Ching Au, David Peng | 2016-07-12 |