Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10935569 | Apparatus and method for packaging, handling or testing of sensors | David P. Potasek, Marcus Allen Childress | 2021-03-02 |
| 10782315 | Apparatus and method for packaging, handling or testing of sensors | David P. Potasek, Marcus Allen Childress | 2020-09-22 |
| 10065853 | Optimized epoxy die attach geometry for MEMS die | Robert Stuelke | 2018-09-04 |
| 9754914 | Method to provide die attach stress relief using gold stud bumps | David Barwig | 2017-09-05 |