Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5494549 | Dicing method | Yoshio Murakami, Tsuyoshi Miyata | 1996-02-27 |
| 5462900 | Method of manufacturing semiconductor elements without burrs | Koichiro Harada, Ryuichi Neki, Kazuo Kawakami, Tsuyoshi Miyata, Kozo Matsuo | 1995-10-31 |
| 5451549 | Semiconductor dicing method which uses variable sawing speeds | Yoshio Murakami | 1995-09-19 |