RF

Ryosuke FUKUDA

Rohm Co.: 10 patents #296 of 2,292Top 15%
DI Diamet: 1 patents #20 of 33Top 65%
Overall (All Time): #430,531 of 4,157,543Top 15%
11
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
12334466 Semiconductor module Kenji Hayashi, Kohei TANIKAWA 2025-06-17
12224231 Semiconductor module Kenji Hayashi, Kohei TANIKAWA 2025-02-11
12191237 Semiconductor module Kenji Hayashi, Kohei TANIKAWA 2025-01-07
12068230 Semiconductor module Kohei TANIKAWA, Kenji Hayashi 2024-08-20
12057426 Semiconductor module Kenji Hayashi, Kohei TANIKAWA 2024-08-06
11961790 Semiconductor module Kenji Hayashi, Kohei TANIKAWA 2024-04-16
11955413 Semiconductor module Kohei TANIKAWA, Kenji Hayashi 2024-04-09
11955451 Semiconductor module Kenji Hayashi, Kohei TANIKAWA 2024-04-09
11955452 Semiconductor module Kenji Hayashi, Kohei TANIKAWA 2024-04-09
11955414 Semiconductor module Kohei TANIKAWA, Kenji Hayashi 2024-04-09
11578393 Heat-resistant sintered material having excellent high-temperature wear resistance and salt damage resistance and method for producing same Masahisa Miyahara 2023-02-14