Issued Patents All Time
Showing 101–105 of 105 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6709892 | Electronic device fabrication method comprising twofold cutting of conductor member | Masahide Maeda, Hiromu Kusunoki | 2004-03-23 |
| 6624007 | Method of making leadframe by mechanical processing | Masahide Maeda | 2003-09-23 |
| 6611049 | Semiconductor device with chamfered substrate and method of making the same | — | 2003-08-26 |
| 6580161 | Semiconductor device and method of making the same | — | 2003-06-17 |
| 6576986 | Semiconductor device with resin package | — | 2003-06-10 |