Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11450592 | Semiconductor package with a plurality of chips having a groove in the encapsulation | Hiroya SANNAI, Yosuke NAKATA, Tatsuya Kawase, Yuji IMOTO | 2022-09-20 |
| 11424398 | Thermoelectric conversion material and thermoelectric conversion module | Yosuke Kurosaki, Shin YABUUCHI, Jun Hayakawa, Yuzuru Miyazaki, Tomohisa Takamatsu | 2022-08-23 |
| 10193323 | Semiconductor device | — | 2019-01-29 |
| 9843318 | Buffer circuit | Kazuaki Hiyama, Kentaro Yoshida | 2017-12-12 |
| 9568385 | Semiconductor pressure sensor, pressure sensor apparatus, electronic equipment, and method of manufacturing semiconductor pressure sensor | Nobuyuki Yamada, Masahiro Sakuragi, Takeshi Yoshida | 2017-02-14 |
| 9003883 | Angular velocity sensor and synchronous detection circuit used therein | Nobuyuki Yamada, Takeshi Yoshida | 2015-04-14 |
| 8816682 | Magnetic sensor | — | 2014-08-26 |
| 8770035 | Semiconductor pressure sensor, pressure sensor apparatus, electronic equipment, and method of manufacturing semiconductor pressure sensor | Nobuyuki Yamada, Masahiro Sakuragi, Takeshi Yoshida | 2014-07-08 |