Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5466968 | Leadframe for making semiconductor devices | Hiroshi Okumura | 1995-11-14 |
| 5411921 | Semiconductor chip die bonding using a double-sided adhesive tape | — | 1995-05-02 |
| 5338972 | Lead frame with deformable buffer portions | — | 1994-08-16 |
| 5304841 | Lead frame | — | 1994-04-19 |