Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10151035 | Electroless metallization of through-holes and vias of substrates with tin-free ionic silver containing catalysts | — | 2018-12-11 |
| 9263524 | Semiconductor materials, apparatuses and methods | Peng Wei, Zhenan Bao | 2016-02-16 |