JW

Justin Wendt

RO Rohinni: 13 patents #5 of 16Top 35%
📍 Twin Falls, ID: #10 of 257 inventorsTop 4%
🗺 Idaho: #915 of 8,810 inventorsTop 15%
Overall (All Time): #305,671 of 4,157,543Top 8%
15
Patents All Time

Issued Patents All Time

Showing 1–15 of 15 patents

Patent #TitleCo-InventorsDate
12230519 Method and apparatus for multiple axis direct transfers of semiconductor devices Sean Kupcow, Nicholas Steven Busch 2025-02-18
12165895 Apparatuses for executing a direct transfer of a semiconductor device die disposed on a first substrate to a second substrate Andrew Huska, Luke Dupin, Cody Peterson 2024-12-10
12094365 Multi-function light apparatus Cody Peterson, Andrew Huska 2024-09-17
11728189 Apparatus to control transfer parameters during transfer of semiconductor devices Cody Peterson, Andrew Huska 2023-08-15
11728195 Apparatuses for executing a direct transfer of a semiconductor device die disposed on a first substrate to a second substrate Andrew Huska, Luke Dupin, Cody Peterson 2023-08-15
11551591 Multi-function light apparatus Cody Peterson, Andrew Huska 2023-01-10
11538699 Method and apparatus for embedding semiconductor devices Cody Peterson, Andrew Huska 2022-12-27
11293603 Light vectoring apparatus Cody Peterson, Monica Hansen, Clint Adams, Andrew Huska 2022-04-05
11094571 Apparatus to increase transferspeed of semiconductor devices with micro-adjustment Andrew Huska, Cody Peterson, Luke Dupin 2021-08-17
11069551 Method of dampening a force applied to an electrically-actuatable element Cody Peterson, Clinton Adams, Sean Kupcow, Andrew Huska 2021-07-20
11062923 Apparatus to control transfer parameters during transfer of semiconductor devices Cody Peterson, Andrew Huska 2021-07-13
10471545 Top-side laser for direct transfer of semiconductor devices Andrew Huska, Cody Peterson 2019-11-12
10309589 Light vectoring apparatus Cody Peterson, Monica Hansen, Clint Adams, Andrew Huska 2019-06-04
10297478 Method and apparatus for embedding semiconductor devices Cody Peterson, Andrew Huska 2019-05-21
10141215 Compliant needle for direct transfer of semiconductor devices Andrew Huska, Cody Peterson, Clinton Adams, Sean Kupcow 2018-11-27