Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5058265 | Method for packaging a board of electronic components | — | 1991-10-22 |
| 5051869 | Advanced co-fired multichip/hybrid package | — | 1991-09-24 |
| 4553435 | Elevated transient temperature leak test for unstable microelectronic packages | Kenneth L. Perkins, Bernard L. Weigand | 1985-11-19 |