Issued Patents All Time
Showing 26–29 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5581877 | Method of fabrication of a circuit board adapted to receive a single in-line module | Gerard A. Woychik | 1996-12-10 |
| 5243145 | Package structure for multichip modules | — | 1993-09-07 |
| 5034568 | Package structure for multichip modules | — | 1991-07-23 |
| 4928387 | Temporary soldering aid for manufacture of printed wiring assemblies | Jerald A. Young | 1990-05-29 |