Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11407635 | Bonding pad layer system, gas sensor and method for manufacturing a gas sensor | Andreas Scheurle, Bernd Klein, Heinz Nedelmann, Heribert Weber, Martin Lapisa +4 more | 2022-08-09 |
| 7165441 | Sensor module having a sensor element surrounded by a heating element | Michael Bauer, Michael Arndt | 2007-01-23 |