Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11046043 | Linerless thermosensitive recording body package | Tomohisa Kakuda, Hiroaki Matsui | 2021-06-29 |
| 10607509 | Linerless label and cutting apparatus | Yasufumi Oda | 2020-03-31 |
| 8709974 | Thermosensitive recording medium | — | 2014-04-29 |
| 8367581 | Thermosensitive recording medium with antibacterial property | — | 2013-02-05 |
| 8168565 | Thermal recording adhesive label | — | 2012-05-01 |
| 7811661 | Heat-sensitive adhesive material | Hiroshi Goto, Tomoyuki Kugo, Mitsunobu Morita, Norihiko Inaba, Takehito Yamaguchi | 2010-10-12 |
| 6980409 | Protective circuit for semiconductor device | — | 2005-12-27 |
| 6847512 | Electrostatic breakdown prevention circuit for semiconductor device | — | 2005-01-25 |