Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8450858 | Method of manufacturing semiconductor device including wiring layout and semiconductor device | Takuya Takahashi, Yuuichi Kohno, Masanori Miyata | 2013-05-28 |
| 7723826 | Semiconductor wafer, semiconductor chip cut from the semiconductor wafer, and method of manufacturing semiconductor wafer | Masanori Miyata, Hidetsugu Miyake, Tadao Uehara, Mikinori Oguni, Akira Washino | 2010-05-25 |