TJ

Tomasz Jewula

RP Rf360 Singapore Pte.: 2 patents #23 of 118Top 20%
QU Qualcomm: 2 patents #5,578 of 12,104Top 50%
EA Epcos Ag: 1 patents #321 of 606Top 55%
SN Snaptrack: 1 patents #76 of 213Top 40%
📍 Borgo San Lazzaro, DE: #21 of 122 inventorsTop 20%
Overall (All Time): #800,444 of 4,157,543Top 20%
6
Patents All Time

Issued Patents All Time

Showing 1–6 of 6 patents

Patent #TitleCo-InventorsDate
12081199 Surface acoustic wave (SAW) device with one or more intermediate layers for self-heating improvement Matthias HONAL 2024-09-03
11855607 Electro-acoustic resonator and method of forming thereof Matthias HONAL, Pei Qiao, Siew Li POH, Siew Ling Koh 2023-12-26
11303263 Component with improved heat dissipation Veit Meister 2022-04-12
11101784 Electrical component with heat dissipation Maximilian SCHIEK, Bernhard Bader, Christian Ceranski 2021-08-24
9728705 Metallization having high power compatibility and high electrical conductivity Charles Binninger, Ulrich Knauer, Helmut Zottl, Werner Ruile, Rudolf Nuessl 2017-08-08
9173305 Metallization having high power compatibility and high electrical conductivity Charles Binninger, Ulrich Knauer, Helmut Zottl, Werner Ruile, Rudolf Nuessl 2015-10-27