Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12404420 | Encapsulating material for compression molding and electronic part device | Seigo Okubo | 2025-09-02 |
| 11854919 | Sealing composition and semiconductor device | Takahiro Horie, Kenta ISHIBASHI, Naoki Namai, Kazuhide Sekiguchi, Keichi HORI | 2023-12-26 |