Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6515047 | Composition of epoxy resin and triazine-formaldehyde-phenol resin | Takayoshi Hirai, Tetsuro Imura, Yoshinobu Ohnuma | 2003-02-04 |
| 6451878 | High molecular weight epoxy resin and resinous composition for printed circuit board | Takayoshi Hirai, Tetsuro Imura, Yoshinobu Ohnuma | 2002-09-17 |
| 6037425 | Epoxy resin composition | Tetsuro Imura, Masayuki Ohta | 2000-03-14 |