Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10844248 | Adhesive composition, adhesive sheet, and back grinding method for semiconductor wafer | Se Ra Kim, Jang Soon Kim, Jae Kwan Lee, Hyun Woo Park | 2020-11-24 |
| 8276280 | Electromotion trim scissors | Kyung Suk Lee, Hyo Cher Kim, Hye Seon Chae, U Suk Park, Kyung Ran KIM +4 more | 2012-10-02 |