HT

Hiroyoshi Taya

RE Renesas Electronics: 13 patents #207 of 4,529Top 5%
RT Renesas Technology: 2 patents #1,374 of 3,337Top 45%
Overall (All Time): #318,133 of 4,157,543Top 8%
15
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
10998288 Method of manufacturing a semiconductor device Tadatoshi Danno, Yoshiharu Shimizu 2021-05-04
10249595 Method of manufacturing a semiconductor device Tadatoshi Danno, Yoshiharu Shimizu 2019-04-02
10236274 Semiconductor device with metal patterns having convex and concave sides Yukihiro Sato, Katsuhiko Funatsu, Takamitsu Kanazawa, Masahiro Koido 2019-03-19
9806035 Semiconductor device Tadatoshi Danno, Yoshiharu Shimizu 2017-10-31
9698125 Power module with a plurality of patterns with convex and concave side Yukihiro Sato, Katsuhiko Funatsu, Takamitsu Kanazawa, Masahiro Koido 2017-07-04
9666518 Semiconductor device Katsuhiko Funatsu, Yukihiro Sato, Takamitsu Kanazawa, Masahiro Koido 2017-05-30
9576885 Semiconductor device Katsuhiko Funatsu, Yukihiro Sato, Takamitsu Kanazawa, Masahiro Koido 2017-02-21
9425165 Method of manufacturing semiconductor device Tadatoshi Danno, Yoshiharu Shimizu 2016-08-23
9024419 Method of manufacturing semiconductor device Tadatoshi Danno, Yoshiharu Shimizu 2015-05-05
8592961 Method of manufacturing a semiconductor device Tadatoshi Danno, Yoshiharu Shimizu 2013-11-26
8513785 Method of manufacturing a semiconductor device Tadatoshi Danno, Yoshiharu Shimizu 2013-08-20
8053875 Method of manufacturing a semiconductor device Tadatoshi Danno, Yoshiharu Shimizu 2011-11-08
7833833 Method of manufacturing a semiconductor device Tadatoshi Danno, Yoshiharu Shimizu 2010-11-16
7691677 Method of manufacturing a semiconductor device Tadatoshi Danno, Yoshiharu Shimizu 2010-04-06
7282396 Method of manufacturing a semiconductor device including using a sealing resin to form a sealing body Tadatoshi Danno, Yoshiharu Shimizu 2007-10-16