Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12062598 | Integrated circuit lead frame and semiconductor device thereof | Yu Wang | 2024-08-13 |
| 11621221 | Ball grid array package and package substrate thereof | Che-Ming Hsu, Sung-Yuan Lin, Yu Wang | 2023-04-04 |