Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6125014 | Via-less connection using interconnect traces between bond pads and a transducer coil of a magnetic head slider | — | 2000-09-26 |
| 5726841 | Thin film magnetic head with trimmed pole tips etched by focused ion beam for undershoot reduction | Hua-Ching Tong, Francis H. Liu, Samuel W. Yuan, Pradeep K. Thayamballi | 1998-03-10 |