Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5001829 | Method for connecting a leadless chip carrier to a substrate | — | 1991-03-26 |
| 4967315 | Metallized ceramic circuit package | — | 1990-10-30 |
| 4647900 | High power thick film resistor | Colleen A. Matier | 1987-03-03 |
| 4417296 | Method of connecting surface mounted packages to a circuit board and the resulting connector | — | 1983-11-22 |
| 4393438 | Porcelain coated metal boards having interconnections between the face and reverse surfaces thereof | — | 1983-07-12 |
| 4383270 | Structure for mounting a semiconductor chip to a metal core substrate | — | 1983-05-10 |
| 4331700 | Method of making a composite substrate | — | 1982-05-25 |
| 4328614 | Method for the manufacture of porcelain coated metal boards having interconnections between the top and bottom surfaces | — | 1982-05-11 |
| 4296272 | Composite substrate | — | 1981-10-20 |
| 4245210 | Thick film resistor element and method of fabricating | Norman R. Landry, Samuel L. Williams | 1981-01-13 |