Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11317505 | Double-sided, high-density network fabrication | Brian Atwood, Thang Nguyen, Sankerlingam Rajendran, Walter B. Aschenbeck, Jr. | 2022-04-26 |
| 11096271 | Double-sided, high-density network fabrication | Brian Atwood, Thang Nguyen, Sankerlingam Rajendran, Walter B. Aschenbeck, Jr. | 2021-08-17 |
| 8963313 | Heterogeneous chip integration with low loss interconnection through adaptive patterning | Sankerlingam Rajendran, Monte R. Sanchez, Susan M. Eshelman, Thomas A. Hanft | 2015-02-24 |