Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11139830 | Bit inversion for data transmission | Fernand Da Fonseca, Richard Gerard Hofmann | 2021-10-05 |
| 7743172 | Die-to-die interconnect interface and protocol for stacked semiconductor dies | Nicolas Chauve, Maxime Leclercq | 2010-06-22 |