Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12295269 | Low-cost and high-strength bi-based superconducting wire/tape and preparation method thereof | Qingbin Hao, Jianfeng Li, Shengnan Zhang, Lihua JIN, Xiaoyan Xu +8 more | 2025-05-06 |
| 10813108 | Data throughput improvement in multi-SIM devices | Jia Tang, Zhibin DANG, Insung Kang, Lu Bai, Weihua Yang | 2020-10-20 |
| 10681653 | Power allocation for uplink transmissions | Congchong RU, Hongbo Yan, Wei Song, Tom Chin, Vivek Chawla | 2020-06-09 |