FI

Fifin Irzhann

QU Qualcomm: 2 patents #5,578 of 12,104Top 50%
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2
Patents All Time

Issued Patents All Time

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
6787901 Stacked dies utilizing cross connection bonding wire Edward Reyes 2004-09-07
6680219 Method and apparatus for die stacking Edward Reyes 2004-01-20