YL

Yung Piu Lau

QL Qpl Limited: 1 patents #4 of 11Top 40%
Overall (All Time): #2,196,437 of 4,157,543Top 55%
2
Patents All Time

Issued Patents All Time

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
6822319 Leadframe for enhanced downbond registration during automatic wire bond process Mohamed Lebbai Moosa Naina 2004-11-23
6667073 Leadframe for enhanced downbond registration during automatic wire bond process Mohamed Lebbai Moosa Naina 2003-12-23