Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8658437 | Package method for electronic components by thin substrate | Yeong-yan Guu | 2014-02-25 |
| 8501502 | Package method for electronic components by thin substrate | Yeong-yan Guu | 2013-08-06 |