Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9513112 | Three dimensional characterization of silicon wafer Vias from combined on-top microscopic and bottom-through laser fringes measurement | John Lam | 2016-12-06 |
| 7071460 | Optical non-contact measuring probe | — | 2006-07-04 |
| 6685415 | Bookbinding method | Laura H. Rush | 2004-02-03 |
| 6322867 | Bookbinding structure and method | Laura H. Rush | 2001-11-27 |
| 6155763 | Bookbinding system and method | Kevin P. Parker, Keith Wilson, Eliza Laffin | 2000-12-05 |